Samsung Electronics Co., Ltd.

Semiconductor Fab

Legal name: Samsung Electronics Co., Ltd. · HQ: KR · Public (005930) · Founded 1969

Integrated device manufacturer operating both design and fabrication. Produces AI memory (HBM) and logic chips. Discloses more granularly than TSMC but fab-level water data by product line is limited.

Disclosure Quality

Score

35/100

Transparency Grade

T-4

minimal disclosure

Grades run T-1 (most transparent) to T-5 (least transparent).

Red flags identified (1)

  • RF-04 · AI-specific energy use not disclosed

See the disclosure audit below for details.

Fiscal year 2023. Score computed from OpenButterfly T1–T6 disclosure framework audit. Confidence tier: C (Estimated, Documented Method).

Environmental Metrics

Fiscal year 2024. Each metric is shown at its most recent available year; rows from a different year are marked.

Confidence tiers: A measured and verified · B company-reported · C documented estimate · D uncertain estimate · E modeled · ND not disclosed.

Total Energy Consumption

37.8 TWh

≈ the annual electricity use of 3.6 million US homes

method: known_capacity_model

Source: OpenButterfly pipeline

C

Scope 1 Emissions

5.55 Mt CO₂e

≈ the annual emissions of 1.2 million passenger cars

method: scope1_ratio_model

Source: OpenButterfly pipeline

E

Scope 2 Emissions (market-based)

10.62 Mt CO₂e

≈ the annual emissions of 2.3 million passenger cars

method: grid_carbon_model

Source: OpenButterfly pipeline

D

Scope 3 Emissions

16.05 Mt CO₂e

≈ the annual emissions of 3.5 million passenger cars

method: scope3_ratio_model

Source: OpenButterfly pipeline

E

Water Withdrawal

55.2 GL

≈ 22,000 Olympic swimming pools of water

method: wue_model

Source: OpenButterfly pipeline

D

Property-Line Noise (estimated)FY 2026

~59.3 dBA at property line

method: cooling_load_noise_model

Source: OpenButterfly pipeline

E

Disclosure Audit

Show 5 disclosure checks (T1–T6 framework)
T1.1

Total electricity consumption disclosed

Company-level energy disclosed; semiconductor division not separated.

Partial
T2.1

Scope 1 GHG emissions disclosed

Disclosed at company level; process node attribution not available.

Partial
T3.1

Total water withdrawal disclosed

Water data disclosed at company level; HBM/logic split not available.

Partial
T1.2

AI-specific energy consumption disclosed

AI memory production energy not separately disclosed.

RF-04 (AI-specific energy use not disclosed)

Not Disclosed
T6.1

GHG accounting methodology documented

ISO 14064 and GHG Protocol referenced.

Partial

Sources

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